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Product center

Automatic 3D solder paste inspection SPI-REFINE series

(1、3D solder paste measurement based on white-light sine-stripe PMP technology;
2、 Solder Paste Height Measurement accuracy up to LM;
3、auto-reconstruction of 3D data of solder pad on PCB surface, calculate the volume, area, height and offset of each solder paste.
)
Equipment model:
Substrate size:
Equipment size:
Weight:
Component supply:
The fastest speed:
Accuracy:
Component size:
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暂未实现,敬请期待
暂未实现,敬请期待
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